• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    PURPOSE: A glass-cutting equipment using laser light is provided, which improves the processing characteristics of a cutting plane and prevents the transformation and damage on glass surface after cutting by using laser. CONSTITUTION: The equipment for cutting a glass(110) contains the parts of: a laser generator(102) emitting laser light whose wavelength is 4 times longer than that of ultraviolet the glass absorbs, as a base wavelength of laser(Lb) of 1064nm; a first secondary high frequency generator(104) positioned on the light way of the base wavelength laser for formation of the first secondary high frequency laser light(Lh1) of 532nm; a second secondary high frequency generator(106) positioned on the light way of the first secondary high frequency generator for formation of the second secondary high frequency laser light(Lh2) of 266nm; and a concentrating lens(108) to concentrate Lh2. The glass is cut by radiating the second secondary high frequency laser light on the glass, absorbing energy of Lh2 into the glass, and supplying mechanical force.
    公开号:KR20030009784A
    申请号:KR1020010044411
    申请日:2001-07-24
    公开日:2003-02-05
    发明作者:정화진；김수길；양병춘；오병석
    申请人:정화진；김수길；양병춘；오병석；
    IPC主号:
    专利说明:

    A cutting apparatus for glass and a method
    [7] BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass cutting device for cutting glass and a method thereof, and more particularly, to a glass cutting device and a method for improving the quality of a cut surface while minimizing damage in portions other than the cut surface.
    [8] Glass has a variety of uses in the industry, and the demand for precision cutting is increasing day by day. For example, in recent years, the demand for flat panel display panels in which fine patterns have been formed using glass as a substrate has been rapidly increasing, and consumers have demanded display panels capable of displaying more precise images. Thus, glass substrates having fine patterns are formed. The cutting process of is becoming increasingly important.
    [9] As a cutting device for glass, which is widely known in the art, a machining device such as a diamond cutter is used, which will be briefly described with reference to FIG. 1. First, in the case of using the diamond cutter 10 to cut the glass 20, at the cutting position of the glass 20 by using the cutter 10 to form a predetermined flaw 30, and then Force is applied to both sides of the glass 20 in which the flaws 30 are formed, thereby separating both sides.
    [10] However, when the cutter 10 is used, it is difficult to apply uniform pressure in the process of forming the flaw 30 at the cut position of the glass 20, so that the processing quality of the cut surface is remarkably poor. there was. In addition, when a pattern is formed on the glass 20, deformation or damage occurs in the pattern in the process of separating the substrate by applying a predetermined force to both sides of the glass 20 after forming the flaw 30. There were many cases.
    [11] Therefore, instead of a machining method such as diamond or cutter 10, a carbon dioxide (CO2) laser is oscillated to heat the cut position of the glass 20, and then the cut portion of the heated glass 10 is cooled rapidly. A method of cutting has been proposed.
    [12] However, in the case of using a carbon dioxide laser as described above, the cutting position of the glass is melted and flowed down by the energy provided from the laser, so that the processing quality of the cut surface is degraded, or when the pattern is formed on the glass, deformation or damage to the pattern There was a problem that occurred.
    [13] SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a glass cutting device and a method thereof in which deformation or damage does not occur in a shape before cutting even though the cut surface of the glass is well processed.
    [1] 1 is a view conceptually showing an example of a conventional glass cutting device.
    [2] Figure 2 conceptually illustrates one embodiment of a glass cutting device according to the present invention.
    [3] 3 conceptually illustrates an example of a second harmonic generator used in the glass cutting device of FIG.
    [4] * Explanation of symbols in the main parts of the drawings
    [5] 102: laser oscillator 104, 106: second harmonic generator
    [6] 108: focusing lens 110: glass
    [14] In order to achieve the above object, the present invention provides a glass cutting device for cutting glass that absorbs ultraviolet rays, comprising: a laser oscillator for oscillating a laser beam having a wavelength approximately 4 times the absorption wavelength of the glass to be cut as a base wavelength; A first second harmonic generator positioned on an optical path of the laser light oscillated from the laser oscillator to generate a first harmonic laser light that is a second harmonic of the laser light of the base wavelength; And a second harmonic of the first second harmonic laser light positioned on the optical path of the first harmonic laser light generated by the first second harmonic generator and having a wavelength absorbed by the glass to be cut. Provided is a glass cutting device including a second secondary harmonic generator for generating a second secondary harmonic laser light.
    [15] Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the configuration and operation of the present invention.
    [16] Referring first to Figure 2, Figure 2 is a view conceptually showing a glass cutting device according to the present invention. As shown, the glass cutting device of the present invention includes an optical system 100 including a laser oscillator 102 and first and second harmonic generators 104 and 106. Furthermore, the glass cutting device of the present invention may further include a support 130 for supporting the glass 110 to be cut and a mechanical force action unit (not shown) for finally cutting the glass by applying mechanical force. .
    [17] First, the laser oscillator 102 is a light source for oscillating a laser light that is a strong straightness light having a single wavelength, in particular, the laser oscillator 102 of the present invention is ultraviolet light that can be absorbed by the glass 110 to be cut It is necessary to oscillate the laser light L B having a wavelength that is about four times the wavelength (hereinafter referred to as “base wavelength”). Examples of the laser oscillator 102 as described above may include various examples, and among those currently commercially available, those known as ND-YAG laser oscillators may be mentioned. The laser light oscillated from the ND-YAG laser oscillator is known to have a wavelength of about 1064 nm, and a laser light having a wavelength of 266 nm corresponding to a quarter of the wavelength is used for a liquid crystal display or a plasma display. It is known to be well absorbed by the glass used as the substrate. Regarding the mechanism in which the laser light having a wavelength corresponding to one quarter of the base wavelength (hereinafter referred to as "secondary second harmonic laser light L H2 ") is used for cutting the glass 110, It will be described later.
    [18] Next, the glass cutting device of the present invention, as part of the optical system 100, receives the laser light (L B ) of the base wavelength oscillated from the laser oscillator 102 and the laser light which is the second harmonic wave thereof. (Hereinafter referred to as “first second harmonic laser light L H1 ”) includes a first second harmonic generator 104. The first second harmonic generator 104 is disposed to be positioned on an optical path of the laser light L B oscillated from the laser oscillator 102.
    [19] The first second harmonic laser light L H1 generated from the first second harmonic generator 104 may have a wavelength corresponding to about 1/2 of the wavelength of the laser light L B of the base wavelength. Have In the first second harmonic generator 104, as shown in FIG. 3, glass fiber 102a doped with germanium (Ge) and phosphorus (P) may be used, or potassium titanyl phosphate ( Non-linear crystals 102b such as KTP: Potassium Titanyl Phosphate, Potassium Dehydrogen Phosphate (KDP), and Beta Barium Borate (BBO) may be used. The mechanism of converting the laser light having the wavelength λ into the laser light having the wavelength λ / 2 corresponding to one-half through the above material is well known in the technical field of laser light. Since the present invention is not intended to be a direct object thereof, it will be omitted.
    [20] Next, the optical system 100 is located on an optical path of the first second harmonic laser light L H1 generated by the first second harmonic generator 104, and the first second second. a second second harmonic generator (106) for generating a harmonic laser light 2nd second harmonic laser light (L H2) as a second harmonic having a wavelength in the glass subject to the cutting can be absorbed in the (L H1) Include.
    [21] The second second harmonic generator 106 is preferably the same as that used in the first second harmonic generator 104 in the examples described above with reference to FIG. Of course, as long as the wavelengths of the waves maintain the above-mentioned relationship, any one may be used.
    [22] Next, the optical system 100 may further include a focusing lens 108 for focusing the second second harmonic laser light L H2 to form a laser light having a small dispersion. . It should be noted that the focusing lens 108 is for forming a more precise cut line and may not be included depending on the application. Details of the focusing lens 108 are already well known in the art of optical instruments, and thus will be omitted.
    [23] As described above, the second second harmonic laser light L H2 generated by the second second harmonic generator is about 1/4 of the wavelength of the laser light L B of the base wavelength. The second second harmonic laser beam L H2 is irradiated to the cutting position 120 of the glass 110 to be cut and its energy is absorbed into the glass 110.
    [24] At the cutting position 120 of the glass 110 that absorbs the high energy of the second harmonic laser light L H2 , a portion of the glass 110 evaporates, and the absorption of the laser light energy and As the evaporation process continues for a predetermined time, a very fine groove is generated at the cutting position 120 of the glass 110, and as the size of the groove increases, the glass 110 is changed at the cutting position 120. Is cut.
    [25] As described above, according to the glass cutting device according to the present invention, the cutting position 120 of the glass 110 to be cut is absorbed by the high energy from the laser beam and evaporated, thereby making it conventional mechanical or melting type. The problem with the cutting device can be fundamentally solved.
    [26] Next, although not shown in Figure 2, the glass cutting device of the present invention as a machining system for supporting the glass 110 to be the cutting object 130 and a mechanical force action unit for providing a mechanical cutting force (not shown) Or not). The mechanical force acting unit (not shown) is for providing a mechanical cutting force for finally cutting the glass 110, and has a predetermined direction (one at a side about the cutting position 120 of the glass 110). Mechanical cutting force, for example, from the top to the bottom of the figure).
    [27] The machining system is to shorten the cutting time of the glass 110, and the cutting force in the direction after a predetermined time elapses after the energy of the second harmonic laser light L H2 begins to be absorbed. It is desirable to provide. Since the specific structure of the machining system can be selected and adopted from those well known in the art, the details thereof will be omitted.
    [28] According to the present invention, not only the processing characteristics of the cut surface of the glass to be cut can be improved, but also deformation and damage can be prevented from occurring on the glass surface after cutting.
    权利要求:
    Claims (7)
    [1" claim-type="Currently amended] In the glass cutting device for cutting the glass that absorbs ultraviolet rays,
    1) As optical system,
    1-1) a laser oscillator for oscillating a laser beam having a wavelength approximately 4 times the absorption wavelength of the glass to be cut as a base wavelength;
    1-2) a first second harmonic generator positioned on an optical path of the laser light oscillated from the laser oscillator to generate a first second harmonic laser light that is a second harmonic of the laser light of the base wavelength; And
    1-3) A wavelength which is located on the optical path of the first harmonic laser light generated by the first harmonic generator 1 and absorbed in the glass to be cut as the second harmonic of the first harmonic laser light. A second second harmonic generator for generating a second second harmonic laser light having:
    2) As a machining system,
    2-1) a support for supporting the glass to be cut; And
    2-2) a mechanical force action unit for providing a mechanical cutting force for the final cutting on any one of the two sides partitioned around the cutting position of the glass to be cut,
    After the second second harmonic laser light is irradiated onto the glass to be cut, predetermined energy is absorbed by the glass from the second second harmonic laser light, and a predetermined time elapses, the mechanical force acting unit is applied to the glass. And the mechanical cutting force is applied to the glass.
    [2" claim-type="Currently amended] The method of claim 1,
    And a focusing lens positioned on an optical path of the second second harmonic laser light and configured to focus the second second harmonic laser light.
    [3" claim-type="Currently amended] In the glass cutting device for cutting the glass that absorbs ultraviolet rays,
    A laser oscillator for oscillating laser light having a wavelength that is about four times the absorption wavelength of the glass to be cut as a base wavelength;
    A first second harmonic generator positioned on an optical path of the laser light oscillated from the laser oscillator to generate a first harmonic laser light that is a second harmonic of the laser light of the base wavelength; And
    A second harmonic wave positioned on the optical path of the first second harmonic laser light generated by the first second harmonic generator and having a wavelength absorbed by the glass to be cut as a second harmonic of the first second harmonic laser light; And a second secondary harmonic generator for generating a second secondary harmonic laser light.
    [4" claim-type="Currently amended] The method of claim 3,
    And a focusing lens positioned on an optical path of the second second harmonic laser light and configured to focus the second second harmonic laser light.
    [5" claim-type="Currently amended] In the glass cutting method for cutting the glass that absorbs ultraviolet rays,
    Oscillating a laser beam having a wavelength that is about four times the absorption wavelength of the glass to be cut as a base wavelength;
    Generating a first harmonic laser light that is a second harmonic of the laser light of the base wavelength;
    Generating a second harmonic laser light having a wavelength absorbed by the glass to be cut as a second harmonic of the first harmonic laser light; And
    Irradiating the second second harmonic laser light onto the glass to be cut to absorb energy;
    Glass cutting method comprising a.
    [6" claim-type="Currently amended] The method of claim 5,
    And focusing the second second harmonic laser light.
    [7" claim-type="Currently amended] The method of claim 5,
    After the second second harmonic laser light is irradiated onto the glass to be cut and predetermined energy is absorbed from the glass by the second second harmonic laser light and a predetermined time elapses, the second glass is to be cut. Glass cutting device further comprising the step of providing a mechanical cutting force for the final cutting on any one of the sides partitioned about the cutting position.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2001-07-24|Application filed by 정화진, 김수길, 양병춘, 오병석
    2001-07-24|Priority to KR1020010044411A
    2003-02-05|Publication of KR20030009784A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1020010044411A|KR20030009784A|2001-07-24|2001-07-24|A cutting apparatus for glass and a method thereof|
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